Massive Ground planes on a multi layer board were my breaking point.
I tried to clean the through holes where a micro USB port was secured and only could get it cleared by drilling out the solder… (Only had a soldering iron and wick available)
I’ve done the rgb mod for an old NES. The PPU is on a big ground plane and just impossible to get off using a wick. Or you can, but now you’ve put so much heat into the chip that you fried it. Need a heat gun or hot plate.
Playstation SD card mod is easier than hand desoldering the NES PPU, and it involves scraping away very thin traces and soldering to them.
Clean everything with a board cleaner/alcohol.
Use a heat gun for the stubborn things.
Solder wick is fine, but if it’s a through hole on a ground plane your going to be there a really long time.
Use the least amount of heat you can get away with.
Sometimes adding fresh solder on top of the old solder helps the heat spread so you can use the wick more effectively.
Constantly use fresh wick, and if it’s really stubborn dip your wick in extra flux.
Desoldering guns are awesome, but a little spendy.
Massive Ground planes on a multi layer board were my breaking point.
I tried to clean the through holes where a micro USB port was secured and only could get it cleared by drilling out the solder… (Only had a soldering iron and wick available)
Adding fresh solder can also help if it’s leaded / flux cored and the existing solder isn’t
I’ve done the rgb mod for an old NES. The PPU is on a big ground plane and just impossible to get off using a wick. Or you can, but now you’ve put so much heat into the chip that you fried it. Need a heat gun or hot plate.
Playstation SD card mod is easier than hand desoldering the NES PPU, and it involves scraping away very thin traces and soldering to them.